ATOP and TE Connectivity Deepen Collaboration on 6.4T CPO Ahead of OFC 2026

ATOP today announced that it will showcase its latest advancement in next-generation Co-Packaged Optics (6.4T CPO) integration at OFC 2026, addressing the increasing performance and bandwidth demands of next-gen AI compute clusters and hyperscale data center networks.

Leveraging ATOP’s core capabilities in optical packaging and precision optoelectronic assembly, and integrating them with ecosystem partner TE Connectivity’s (TE) high-speed connectivity, socket & pluggable interconnect systems, and large-scale engineering deployment expertise, this collaboration establishes a seamless bridge between optical engines and electrical connectivity—delivering a practical, scalable, and deployment-ready 6.4T CPO solution.

As AI infrastructure continues to scale, the industry requires solutions that not only deliver performance, but also simplify integration and accelerate time-to-deployment. This joint approach aims to provide customers with a clearer and more executable roadmap for next-generation optical interconnect architectures.

More details will be shared during OFC 2026. Stay tuned.

March 17-19 | Los Angeles Convention Center, Los Angeles, CA